APC by Schneider Electric launches new cooling unit for data systems

September 15, 2010 11:20 am 

MANILA, Sept. 15 — APC by Schneider Electric, one of the world's leaders in critical power and cooling services, announced that it has launched its nRow® OA and Refrigerant Distribution Unit (RDU) pumped refrigerant cooling system as part of its efforts to make data centers in the country more energy efficient and environment friendly.

“Data center densities continue to increase and efficiency concerns encourage customers to maximize all the available space for physical infrastructure,” APC enterprise system, service and software senior president Dave Guidette said.

He added that APC InRow OA expands APC’s leading InRow product line by providing an overhead, energy efficient, refrigerant based cooling solution for data center environments.

“The new APC InRow OA and RDU provide data center managers with increased flexibility by eliminating the need to remove or break-up racks to implement a row-based cooling architecture to meet the needs of higher density loads,” Guidette stressed.

He added that it is ideal for medium and high density applications as it can captured up to 27 kilowatts (KW) of hot IT exhaust air at the source, neutralizes it and discharges cool, ambient air to the IT space.

The system includes integrated thermal containment, which eliminates mixing of hot and cold air streams – improving cooling predictability.

Modular construction, variable speed fans and active response controls are all integrated into one high efficiency system.

The over head design requires zero whitespace because it can be mounted on a rack or suspended from the ceiling above the hot aisle, improving flexibility and the ability to adapt to existing data center environments.

This refrigerant-based system has been developed to eliminate the threat from water leaks in close proximity to IT equipment.

Guidette said the RDU has the ability to modulate capacity from 0-100 percent with no minimum loading requirements and may be placed in the IT environment or in an adjacent location to further increase whitespace utilization for IT equipment.

Other key components to this system include modular piping headers and the mounting structure of the APC InRow OA.(PNA)

LDV/PFN

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